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Capabilities

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Current location >PCB CapabilitiesPCB Capabilities

Production Capability

Item

parameters

remark

max layers

80L

Min conductor width

3mil

1OZ

Min space

3mil

1OZ

Min ring

via hole: 3mil

From the hole to the ring edge

Component hole:4mil

Min hole size

Drilling

0.15mm

Laser drilling

0.1mm

Max Thickess

special PCB

0.127-8.0mm

Multi-layers

0.4-8.0mm

Hole aperture ratio

13:1

Max size

special

600 x 800mm

Multi-layers

800 x 1200mm

Max Layers

40L

Impedence

土10%

S/M color

white, black,blue,green,yellow,red,

legend

white black

Surface finish

OSP, HASL, immersion gold,immersion tin,immersion silver, solft gold, NI-PD gold,gold finger,pure Ni,

Copper thickness

outer

7OZ

inner

5OZ

comon processing

count-sink hole, VIPO process, flex-rigid

base material

FR-4、PTFE, thick copper PCB,BT,Rogers PCB,copper-core PCB

通信器材:转换器、接收器、振荡器、天线 Telecom:transmitter.receiver.oscillator.antenna
卫星接收器 Satellite receiver
全球定位系统、功率放大器、卫星通信 Global location system、amplifier.satellite telecom
微波传输 Microwave transmission
汽车电话 Automobile telephone
测量仪器、LSI检验器、分析器、信号振荡器 Measure apparatus.LSI inspector.analyser.signal  oscillator
高频通信、高速传输、高保密性、高传送质
量、高记忆容量处理
High frequency telecom.high speed transmission high security.
high transmission quality.high memory  transaction

Lead time

1-2layer FR4 ------12hours

4-10layers---------24hours

10-20layers--------72hours

special base material-----48hours

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