Manufacturing Capacity

24 hours turn time on double sides PCB's,2-4 days for multilayer PCB's.
Producing over 19,000 unique part numbers per month .
Current products manufactured include backplanes, hybrid boards, HDI boards, High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards, Metal Substrate boards, IC Substrate boards and more.
Fastprint has purchased advanced PCB manufacturing equipments, inspection equipments and software from the United States, Japan, Israel, Germany, Italy and Taiwan.

Production Capabilities

Layers count: 50
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* 49″
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco...)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.

Rigid-Flex Board

Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer:36/10
Min Line width/spacing for inner layer(mil): 3.0/3.0
Max Aspect Ratio: 20:1
Min Hole size(mil): 6
Impedance control:10%
HDI

HDI

3+C+3: Mass production

4+C+4：Small volume﹠Mass production

Laser via（Plugging via）：Mass production

Min microvia hole size(mil) ：4

Metal substrate board

Layers count：Metal substrate: 1-12L

Embedded metal/Heat sink/Sweat bonding: 2-24L

Ceramic substrate: 1-2L

Board thickness ：0.5-7.0mm

Size：max:610*610 mm ,min:5*5mm

Mechanic: X/Y/Z tolerance±0.03mm, speaker hole, screw hole

Thermal conductivity: Standard materials: 1-4W/m.k,

Specified materials : 5-12W/m.k

Ceramic materials: 24-170W/m.k

Max copper thickness：28OZ

Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical                                              passivation, Sandblasting, Wire drawing, Al electroplating

Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold,                                   Immersion Sn, immersion silver, Organic Coating

Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink,

Ceramic substrate